Key Facts
• Mitsubishi Materials developed oxygen-free copper resistant to crystal grain growth during heat treatment.
• Maintains fine, uniform crystal structure even after 1000°C heat treatment.
• Offers excellent electrical and thermal conductivity, enhancing electronic components’ quality and process stability.
• Product name: MOFC-GC, created using proprietary material design and patented technology.
• Available in thicknesses ranging from 0.3 mm to 1.2 mm.
• Suitable for active metal brazing (AMB) substrates used in semiconductor heat dissipation.
• Improves optical recognition and smoothness of circuit layers.
• AMB substrates are critical for power control and conversion in electric vehicles (xEVs).
• Combines ceramics and oxygen-free copper, minimizing crystal grain coarsening across a wide temperature range.
Summary
Mitsubishi Materials has introduced MOFC-GC, a high-performance oxygen-free copper that resists crystal grain growth even after 1000°C heat treatment. This innovation, achieved through proprietary design and patented technology, ensures fine, uniform crystal structures, offering superior electrical and thermal conductivity. Available in thicknesses from 0.3 mm to 1.2 mm, it is ideal for active metal brazing (AMB) substrates used in semiconductor heat dissipation. These substrates, essential for power control in electric vehicles, benefit from improved optical recognition and smoothness. The material’s ability to prevent crystal grain coarsening across a wide temperature range addresses critical manufacturing needs.
